0.25mm Blister Tray Packaging Embossing Logo With SGS Certification

ECO Friendly Blister Packaging Box Embossing Logo With SGS Certification

This 0.25mm thin-gauge blister tray is engineered for lightweight, space-saving electronic component packaging with integrated ESD protection and custom branding capability. Manufactured with precision thermoforming technology using premium PET, PP and PS materials, it delivers stable electrostatic discharge performance within 10E6 to 10E10 Ohm, effectively safeguarding sensitive electronic parts from static damage during storage, transportation and SMT production. The embossed logo process allows customers to embed brand identification directly onto the tray surface without additional labeling, supporting product traceability and brand presentation. With a 0.25mm optimized wall thickness, the tray maintains sufficient structural rigidity while reducing material weight and packaging volume. SGS certified and fully customizable in dimensions and cavity layout, it adapts to various electronic component specifications and batch packaging needs.

Function

- Stable ESD performance (10E6-10E10 Ohm) protects sensitive electronic components from electrostatic damage
- 0.25mm optimized wall thickness balances structural rigidity and lightweight packaging cost
- Embossing logo process enables direct brand marking and product traceability without extra labels
- Custom cavity design precisely positions electronic parts to prevent collision and scratching
- SGS certified material and production comply with international electronic industry quality standards
- Black opaque finish provides light shielding for light-sensitive semiconductor components
- Stackable structure saves storage and logistics space, compatible with automated production lines

 

Application

 

- Batch packaging and turnover of SMD resistors, capacitors, IC chips and connectors
- ESD protective packaging for semiconductor components in production and logistics
- Precision electronic parts storage and transportation in electronics manufacturing workshops
- SMT production line component feeding and process turnover trays
- Brand-customized inner packaging for consumer electronics spare parts

 

Technical Parameters

 

Parameter	Specification
Product Name	0.25mm Blister Tray Packaging Embossing Logo With SGS Certification
Brand	ACE DELIXIN
Model	Customized
Material	PET / PP / PS
Color	Black
Logo Process	Embossing
ESD Surface Resistance	10E6 - 10E10 Ohm
Size	Customized according to customer requirements
Certification	ROHS
Place of Origin	China
MOQ	2000 pcs
Unit Price	Discussable
Supply Capacity	100,000 pcs / month
Delivery Time	10 days
Payment Terms	L/C, T/T
Standard Packing	According to customer's requests